LOCTITE® ABLESTIK 5025E
Omadused ja eelised
This silver-filled film adhesive provides thin, uniform bondline control and is particularly suited for bonding hot devices onto heat sinks in applications, combining grounding performance with thermal dissipation capabilities.
For a cleaner, no-waste alternative to paste when you’re working with microwave circuitry and heat sink attach applications, LOCTITE® ABLESTIK 5025E is a great choice. This silver-filled electrically conductive thin-film adhesive offers uniform bondline control and excellent thermal and electrical conductivity. Particularly ideal for bonding hot devices onto heat sinks in large bonding area applications, this product provides RF/EMI shielding, passes NASA outgassing standards, and meets MIL-STD-883, Method 5011 requirements.
Lugege rohkem
Dokumendid ja allalaadimised
Otsite TDS-i või SDS-i teises keeles?
Tehniline teave
| Asutuse kooskõlastused / sertifikaadid / spetsifikatsioonid | MIL Standard 883, Method 5012 |
| Füüsiline vorm | Kile |
| Klaasistumistemperatuur (Tg) | 90.0 °C |
| Kõvenemisaeg, @ 150.0 °C | 30.0 minut |
| Nihkejõud, Alumiinium | 2000.0 psi |
| Soojusjuhtivus | 6.5 W/mK |
| Tahkumistüüp | Kuumkõvenemine |
LOCTITE® ABLESTIK 5025E
This silver-filled film adhesive provides thin, uniform bondline control and is particularly suited for bonding hot devices onto heat sinks in applications, combining grounding performance with thermal dissipation capabilities.