LOCTITE® ABLESTIK 5025E
Características e Vantagens
This silver-filled film adhesive provides thin, uniform bondline control and is particularly suited for bonding hot devices onto heat sinks in applications, combining grounding performance with thermal dissipation capabilities.
For a cleaner, no-waste alternative to paste when you’re working with microwave circuitry and heat sink attach applications, LOCTITE® ABLESTIK 5025E is a great choice. This silver-filled electrically conductive thin-film adhesive offers uniform bondline control and excellent thermal and electrical conductivity. Particularly ideal for bonding hot devices onto heat sinks in large bonding area applications, this product provides RF/EMI shielding, passes NASA outgassing standards, and meets MIL-STD-883, Method 5011 requirements.
Ler mais
Documentos e Transferências
Procura uma FDT ou FDS noutro idioma?
Informação Técnica
| Aprovações da agência/certificados/especificações | Norma MIL 883, Método 5011 |
| Condutividade térmica | 6.5 W/mK |
| Cronograma de cura, @ 150.0 °C | 30.0 min. |
| Forma física | Película |
| Força de cisalhamento, Alumínio | 2000.0 psi |
| Temperatura de transição do vidro (Tg) | 90.0 °C |
| Tipo de cura | Cura de Calor |
LOCTITE® ABLESTIK 5025E
This silver-filled film adhesive provides thin, uniform bondline control and is particularly suited for bonding hot devices onto heat sinks in applications, combining grounding performance with thermal dissipation capabilities.