LOCTITE ABLESTIK 5662
fitur dan keuntungan
LOCTITE ABLESTIK 5662, Epoxy Film, Assembly
LOCTITE® ABLESTIK 5662 epoxy adhesive is specially designed for applications where both flexibility and good adhesion are required. LOCTITE ABLESTIK 5662 adhesive is particularly useful in applications requiring good insulation between two substrates, such as bonding PC boards with solder bumps to heat sinks. This adhesive is also suitable for bonding materials with mismatched coefficients of thermal expansion.
- Low temperature cure
- Flexible
- Good adhesion
Dokumen dan Unduhan
Mencari TDS atau SDS dalam bahasa lain?
Informasi Teknis
Formulir Fisik | Film |
Jadwal Pengerasan, @ 90.0 °C | 3.0 hr. |
Jenis Karier | Kapton |
Kekuatan Geser, Aluminum | 2300.0 psi |
Ketebalan Lem Lembaran Karier | 2.0 mil |
Konduktivitas Termal | 0.2 W/mK |
Suhu Transisi Kaca (Tg) | 100.0 °C |
Teknologi | Epoxy |
Tipe Pengeringan | Heat Cure |