LOCTITE® ABLESTIK 5662

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LOCTITE ABLESTIK 5662, Epoxy Film, Assembly
LOCTITE® ABLESTIK 5662 epoxy adhesive is specially designed for applications where both flexibility and good adhesion are required. LOCTITE ABLESTIK 5662 adhesive is particularly useful in applications requiring good insulation between two substrates, such as bonding PC boards with solder bumps to heat sinks. This adhesive is also suitable for bonding materials with mismatched coefficients of thermal expansion.
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Información técnica

Conductividad térmica 0.2 W/mK
Esfuerzo de corte, Aluminio 2300.0 psi
Espesor de la película portadora 2.0 mil
Forma física Película
Programa de curado, @ 90.0 °C 3.0 h
Temperatura de transición vítrea (Tg) 100.0 °C
Tipo de curado Curado Térmico
Tipo de portador Kapton