LOCTITE® ABLESTIK 5662

Caractéristiques et avantages

LOCTITE ABLESTIK 5662, Epoxy Film, Assembly
LOCTITE® ABLESTIK 5662 epoxy adhesive is specially designed for applications where both flexibility and good adhesion are required. LOCTITE ABLESTIK 5662 adhesive is particularly useful in applications requiring good insulation between two substrates, such as bonding PC boards with solder bumps to heat sinks. This adhesive is also suitable for bonding materials with mismatched coefficients of thermal expansion.
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Informations techniques

Conductivité thermique 0.2 W/mK
Forme physique Film
Programme de durcissement, @ 90.0 °C 3.0 hr.
Résistance au cisaillement, Aluminium 2300.0 psi
Température de transition vitreuse 100.0 °C
Type de polymérisation Polymérisation par la chaleur
Type porteur Kapton
Épaisseur film porteur 2.0 mil