LOCTITE ABLESTIK 5662

Features and Benefits

LOCTITE ABLESTIK 5662, Epoxy Film, Assembly
LOCTITE® ABLESTIK 5662 epoxy adhesive is specially designed for applications where both flexibility and good adhesion are required. LOCTITE ABLESTIK 5662 adhesive is particularly useful in applications requiring good insulation between two substrates, such as bonding PC boards with solder bumps to heat sinks. This adhesive is also suitable for bonding materials with mismatched coefficients of thermal expansion.
  • Low temperature cure
  • Flexible
  • Good adhesion
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Technical Information

Carrier Film Thickness 2 mil
Carrier Type Kapton
Cure Schedule Temperature (Step 1) 194
Cure Schedule Temperature Unit (Step 1) °F
Cure Schedule Time (Step 1) 3
Cure Schedule Time Unit (Step 1) hr.
Cure Type Heat Cure
Physical Form Film
Shear Strength Unit, Aluminum psi
Shear Strength, Aluminum 2300
Technology Epoxy
Tg 212 °F
Thermal Conductivity 0.2 W/mK