LOCTITE ABLESTIK 5662
Features and Benefits
LOCTITE ABLESTIK 5662, Epoxy Film, Assembly
LOCTITE® ABLESTIK 5662 epoxy adhesive is specially designed for applications where both flexibility and good adhesion are required. LOCTITE ABLESTIK 5662 adhesive is particularly useful in applications requiring good insulation between two substrates, such as bonding PC boards with solder bumps to heat sinks. This adhesive is also suitable for bonding materials with mismatched coefficients of thermal expansion.
- Low temperature cure
- Flexible
- Good adhesion
Documents and Downloads
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Technical Information
| Carrier Film Thickness | 2 mil |
| Carrier Type | Kapton |
| Cure Schedule Temperature (Step 1) | 194 |
| Cure Schedule Temperature Unit (Step 1) | °F |
| Cure Schedule Time (Step 1) | 3 |
| Cure Schedule Time Unit (Step 1) | hr. |
| Cure Type | Heat Cure |
| Physical Form | Film |
| Shear Strength Unit, Aluminum | psi |
| Shear Strength, Aluminum | 2300 |
| Technology | Epoxy |
| Tg | 212 °F |
| Thermal Conductivity | 0.2 W/mK |
LOCTITE ABLESTIK 5662