LOCTITE® ABLESTIK 5662

Características y Ventajas

LOCTITE ABLESTIK 5662, Epoxy Film, Assembly
LOCTITE® ABLESTIK 5662 epoxy adhesive is specially designed for applications where both flexibility and good adhesion are required. LOCTITE ABLESTIK 5662 adhesive is particularly useful in applications requiring good insulation between two substrates, such as bonding PC boards with solder bumps to heat sinks. This adhesive is also suitable for bonding materials with mismatched coefficients of thermal expansion.
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Información técnica

Conductividad térmica 0.2 W/mK
Espesor de la película del vehículo 2.0 mil
Forma Física Película
Programa de curado, @ 90.0 °C 3.0 h
Resistencia al corte, Aluminio 2300.0 psi
Temperatura de transición vítrea (Tg) 100.0 °C
Tipo de curado Curado Térmico
Tipo de vehículo Kapton