LOCTITE® ABLESTIK 5662

Merkmale und Vorteile

LOCTITE ABLESTIK 5662, Epoxy Film, Assembly
LOCTITE® ABLESTIK 5662 epoxy adhesive is specially designed for applications where both flexibility and good adhesion are required. LOCTITE ABLESTIK 5662 adhesive is particularly useful in applications requiring good insulation between two substrates, such as bonding PC boards with solder bumps to heat sinks. This adhesive is also suitable for bonding materials with mismatched coefficients of thermal expansion.
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Technische Informationen

Aushärtetechnik Aushärtung durch Wärme
Aushärtezyklus, @ 90.0 °C 3.0 h
Glasübergangstemperatur (Tg) 100.0 °C
Physikalische Form Film
Scherfestigkeit, Aluminium 2300.0 psi
Träger Kapton
Trägerfilmdicke 2.0 mil
Wärmeleitfähigkeit 0.2 W/mK