LOCTITE® ABLESTIK 5662

Features and Benefits

LOCTITE ABLESTIK 5662, Epoxy Film, Assembly
LOCTITE® ABLESTIK 5662 epoxy adhesive is specially designed for applications where both flexibility and good adhesion are required. LOCTITE ABLESTIK 5662 adhesive is particularly useful in applications requiring good insulation between two substrates, such as bonding PC boards with solder bumps to heat sinks. This adhesive is also suitable for bonding materials with mismatched coefficients of thermal expansion.
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Technical Information

Carrier film thickness 2.0 mil
Carrier type Kapton
Cure schedule, @ 90.0 °C 3.0 hr.
Cure type Heat cure
Glass transition temperature (Tg) 100.0 °C
Physical form Film
Shear strength, Aluminium 2300.0 psi
Thermal conductivity 0.2 W/mK