LOCTITE ECCOBOND DP 1006
fitur dan keuntungan
LOCTITE ECCOBOND DP 1006, Epoxy, Die attach and Encapsulant, non-conductive
LOCTITE® ECCOBOND DP 1006 fast and low temperature adhesive is formulated for use in digital printing applications.
- One component
- Non-conductive
- Extremely flexible
- Fast cure
Dokumen dan Unduhan
Mencari TDS atau SDS dalam bahasa lain?
Informasi Teknis
| Aplikasi | Pelekat Die, Enkapsulasi |
| Jadwal Pengerasan, Disarankan @ 140.0 °C | 2.0 sec. |
| Koefisien Muai Termal (CTE), Above Tg | 220.0 ppm/°C |
| Koefisien Muai Termal (CTE), Below Tg | 50.0 ppm/°C |
| Suhu Penyimpanan | -20.0 °C |
| Suhu Transisi Kaca (Tg) | 27.0 °C |
| Tipe Pengeringan | Heat Cure |
| Viskositas, Brookfield, @ 25.0 °C Speed 5 rpm | 65000.0 mPa.s (cP) |
| Warna | Kuning: Kuning Terang |
LOCTITE ECCOBOND DP 1006
LOCTITE ECCOBOND DP 1006, Epoxy, Die attach and Encapsulant, non-conductive