LOCTITE® ABLESTIK QMI538NB
功能与优点
LOCTITE ABLESTIK QMI538NB, BMI Hybrid, Die Attach, Non-conductive Paste
LOCTITE® ABLESTIK QMI538NB is a non-conductive die attach paste designed for applications which require very low stress and robust mechanical properties. Please refer to the TDS for alternate cure schedules.
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技术信息
| 储存温度 | -40.0 °C |
| 可萃取出的离子含量, 氟化物 (F-) | 19.0 ppm |
| 可萃取出的离子含量, 氯化物 (CI-) | 19.0 ppm |
| 可萃取出的离子含量, 钠 (Na+) | 19.0 ppm |
| 可萃取出的离子含量, 钾 (K+) | 19.0 ppm |
| 固化方式 | 热+紫外线 |
| 应用 | 芯片焊接 |
| 拉伸模量, @ 25.0 °C | 100.0 N/mm² (14500.0 psi ) |
| 热模剪切强度 | 15.0 kg-f |
| 热膨胀系数 (CTE) | 59.0 ppm/°C |
| 热膨胀系数 (CTE), Above Tg | 130.0 ppm/°C |
| 玻璃化温度 (Tg) | -70.0 °C |
| 粘度, @ 25.0 °C | 8200.0 mPa.s (cP) |
| 触变指数 | 5.0 |
LOCTITE® ABLESTIK QMI538NB
LOCTITE ABLESTIK QMI538NB, BMI Hybrid, Die Attach, Non-conductive Paste