LOCTITE® ABLESTIK QMI538NB
Features and Benefits
LOCTITE ABLESTIK QMI538NB, BMI Hybrid, Die Attach, Non-conductive Paste
LOCTITE® ABLESTIK QMI538NB is a non-conductive die attach paste designed for applications which require very low stress and robust mechanical properties. Please refer to the TDS for alternate cure schedules.
- Non-conductive
- Low viscosity
- Reduced resin bleed
- Hydrophobic
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Technical Information
| Applications | Die attach |
| Coefficient of thermal expansion (CTE) | 59.0 ppm/°C |
| Coefficient of thermal expansion (CTE), Above Tg | 130.0 ppm/°C |
| Cure type | Heat cure |
| Extractable ionic content, Chloride (CI-) | 19.0 ppm |
| Extractable ionic content, Fluoride (F-) | 19.0 ppm |
| Extractable ionic content, Potassium (K+) | 19.0 ppm |
| Extractable ionic content, Sodium (Na+) | 19.0 ppm |
| Glass transition temperature (Tg) | -70.0 °C |
| Hot die shear strength | 15.0 kg-f |
| Storage temperature | -40.0 °C |
| Tensile modulus, @ 25.0 °C | 100.0 N/mm² (14500.0 psi ) |
| Thixotropic index | 5.0 |
| Viscosity, @ 25.0 °C | 8200.0 mPa·s (cP) |
LOCTITE® ABLESTIK QMI538NB
LOCTITE ABLESTIK QMI538NB, BMI Hybrid, Die Attach, Non-conductive Paste