LOCTITE® ABLESTIK QMI538NB
Features and Benefits
LOCTITE ABLESTIK QMI538NB, BMI Hybrid, Die Attach, Non-conductive Paste
LOCTITE® ABLESTIK QMI538NB is a non-conductive die attach paste designed for applications which require very low stress and robust mechanical properties. Please refer to the TDS for alternate cure schedules.
Read More
Documents and Downloads
Looking for a TDS or SDS in another language?
Technical Information
| Applications | Die attach |
| Coefficient of thermal expansion (CTE) | 59.0 ppm/°C |
| Coefficient of thermal expansion (CTE), Above Tg | 130.0 ppm/°C |
| Cure type | Heat cure |
| Extractable ionic content, Chloride (CI-) | 19.0 ppm |
| Extractable ionic content, Fluoride (F-) | 19.0 ppm |
| Extractable ionic content, Potassium (K+) | 19.0 ppm |
| Extractable ionic content, Sodium (Na+) | 19.0 ppm |
| Glass transition temperature (Tg) | -70.0 °C |
| Hot die shear strength | 15.0 kg-f |
| Storage temperature | -40.0 °C |
| Tensile modulus, @ 25.0 °C | 100.0 N/mm² (14500.0 psi ) |
| Thixotropic index | 5.0 |
| Viscosity, @ 25.0 °C | 8200.0 mPa·s (cP) |
LOCTITE® ABLESTIK QMI538NB
LOCTITE ABLESTIK QMI538NB, BMI Hybrid, Die Attach, Non-conductive Paste