BERGQUIST® GAP FILLER TGF 2000
Conosciuto come Gap Filler 2000
Caratteristiche e vantaggi
BERGQUIST GAP FILLER TGF 2000 is a silicone-based, thermally conductive and form-in-place gap filler ideal for fragile and low stress applications.
BERGQUIST® GAP FILLER TGF 2000 is a two component, thermally conductive, silicone based liquid gap filler. It can be cured at room temperature and the curing process can be accelerated with heat. This product exhibits low modulus and good compression set. It also exhibits excellent low and high temperature mechanical and chemical stability and hence is fit for use over a wide range of temperatures.
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Informazioni tecniche
| Capacità termiche, ASTM E1269 | 1.0 J/g-K |
| Classe di infiammabilità | V-0 |
| Conducibilità termica | 2.0 W/mK |
| Costante dielettrica, @ 1kHz | 7.0 |
| Densità | 2.9 g/cm³ |
| Durezza shore, Thirty second delay value, ASTM D2240 Shore 00 | 70.0 |
| Rapporto di miscelazione in peso | 1 : 1 |
| Rapporto di miscelazione in volume | 1 : 1 |
| Resistività di volume | 1×10 Ohm m |
| Shelf life | 6.0 vero |
| Temperatura di stoccaggio | 25.0 °C |
| Indurente | |
| Colore, Indurente | Bianco |
| Resina | |
| Colore, Resina | Rosa |
BERGQUIST® GAP FILLER TGF 2000
BERGQUIST GAP FILLER TGF 2000 is a silicone-based, thermally conductive and form-in-place gap filler ideal for fragile and low stress applications.