BERGQUIST® GAP FILLER TGF 2000

Žinoma kaip Gap Filler 2000

Savybės ir privalumai

BERGQUIST GAP FILLER TGF 2000 is a silicone-based, thermally conductive and form-in-place gap filler ideal for fragile and low stress applications.
BERGQUIST® GAP FILLER TGF 2000 is a two component, thermally conductive, silicone based liquid gap filler. It can be cured at room temperature and the curing process can be accelerated with heat. This product exhibits low modulus and good compression set. It also exhibits excellent low and high temperature mechanical and chemical stability and hence is fit for use over a wide range of temperatures.
Aprašymas

Techniniai duomenys

Derva
Spalva, Derva Rožinė
Dielektrinė konstanta, @ 1kHz 7.0
Galiojimo laikas 6.0 mėn.
Laikymo temperatūra 25.0 °C
Liepsnos įvertinimas V-0
Mišinio santykis pagal svorį 1 : 1
Mišinio santykis pagal tūrį 1 : 1
Tankis 2.9 g/cm³
Tūrio varža 1×10 Ohm m
Šilumos laidumas 2.0 W/mK
Šilumos talpa, ASTM E1269 1.0 J/g-K
„Shore“ kietumas, Thirty second delay value, ASTM D2240 Shore 00 70.0
Kietiklis
Spalva, Kietiklis Balta