BERGQUIST® GAP FILLER TGF 2000
Zināms kā Gap Filler 2000
Iezīmes un ieguvumi
BERGQUIST GAP FILLER TGF 2000 is a silicone-based, thermally conductive and form-in-place gap filler ideal for fragile and low stress applications.
BERGQUIST® GAP FILLER TGF 2000 is a two component, thermally conductive, silicone based liquid gap filler. It can be cured at room temperature and the curing process can be accelerated with heat. This product exhibits low modulus and good compression set. It also exhibits excellent low and high temperature mechanical and chemical stability and hence is fit for use over a wide range of temperatures.
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Tehniskā informācija
| Blīvums | 2.9 g/cm³ |
| Cietība, Thirty second delay value, ASTM D2240 Shore 00 | 70.0 |
| Derīguma termiņš | 6.0 mēn. |
| Dielektriskā konstante, @ 1kHz | 7.0 |
| Liesmas novērtējums | V-0 |
| Sajaukšanas attiecība, pēc svara | 1 : 1 |
| Sajaukšanas attiecība, pēc tilpuma | 1 : 1 |
| Siltuma jauda, ASTM E1269 | 1.0 J/g-K |
| Siltumvadītspēja | 2.0 W/mK |
| Tilpuma pretestība | 1×10 Ohm m |
| Uzglabāšanas temperatūra | 25.0 °C |
| Sveķi | |
| Krāsa, Sveķi | Sārta |
| Cietinātājs | |
| Krāsa, Cietinātājs | Balta |
BERGQUIST® GAP FILLER TGF 2000
BERGQUIST GAP FILLER TGF 2000 is a silicone-based, thermally conductive and form-in-place gap filler ideal for fragile and low stress applications.