BERGQUIST® GAP FILLER TGF 2000
Známe ako Gap Filler 2000
Vlastnosti a výhody
BERGQUIST GAP FILLER TGF 2000 is a silicone-based, thermally conductive and form-in-place gap filler ideal for fragile and low stress applications.
BERGQUIST® GAP FILLER TGF 2000 is a two component, thermally conductive, silicone based liquid gap filler. It can be cured at room temperature and the curing process can be accelerated with heat. This product exhibits low modulus and good compression set. It also exhibits excellent low and high temperature mechanical and chemical stability and hence is fit for use over a wide range of temperatures.
Viac info
Dokumenty na prevzatie
Hľadáte TL alebo KBÚ v inom jazyku
Technické informácie
| Dielektrická konštanta, @ 1kHz | 7.0 |
| Hodnotenie horľavosti | V-0 |
| Hustota | 2.9 g/cm³ |
| Objemový odpor | 1×10 Ohm m |
| Skladovateľnosť | 6.0 mesiac |
| Tepelná kapacita, ASTM E1269 | 1.0 J/g-K |
| Tepelná vodivosť | 2.0 W/mK |
| Teplota skladovania | 25.0 °C |
| Tvrdosť v jednotke Shore, Thirty second delay value, ASTM D2240 Shore 00 | 70.0 |
| Zmiešavací pomer podľa hmotnosti | 1 : 1 |
| Zmiešavací pomer podľa objemu | 1 : 1 |
| Živica | |
| Farba, Živica | Ružová |
| Tvrdidlo | |
| Farba, Tvrdidlo | Biela |
BERGQUIST® GAP FILLER TGF 2000
BERGQUIST GAP FILLER TGF 2000 is a silicone-based, thermally conductive and form-in-place gap filler ideal for fragile and low stress applications.