LOCTITE® ABLESTIK QMI529HT-2A1
Caratteristiche e vantaggi
This electrically conductive adhesive works well for high throughput die attach applications. Expect high accuracy and a controlled bondline.
For continuous high resistance to delamination and popcorning, choose LOCTITE® ABLESTIK QMI529HT-2A1. This high strength, hybrid technology, electrically conductive die attach adhesive is hydrophobic, and ideal for high accuracy applications with consistent bondline thickness for superior functionality. This product and its use may be covered by patent 5,716,034 and by one or more pending patent applications.
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Informazioni tecniche
| Applicazioni | Die attach |
| Coefficiente di espansione termica (CTE) | 53.0 ppm/°C |
| Coefficiente di espansione termica (CTE), Above Tg | 156.0 ppm/°C |
| Conducibilità termica | 6.0 W/mK |
| Indice tixotropico | 4.8 |
| Temperatura di transizione vetrosa (Tg) | 3.0 °C |
| Tipo di polimerizzazione | Polimerizzazione a caldo |
| Viscosità | 185000.0 mPa.s (cP) |
LOCTITE® ABLESTIK QMI529HT-2A1
This electrically conductive adhesive works well for high throughput die attach applications. Expect high accuracy and a controlled bondline.