LOCTITE® ABLESTIK QMI529HT-2A1
功能与优点
This electrically conductive adhesive works well for high throughput die attach applications. Expect high accuracy and a controlled bondline.
For continuous high resistance to delamination and popcorning, choose LOCTITE® ABLESTIK QMI529HT-2A1. This high strength, hybrid technology, electrically conductive die attach adhesive is hydrophobic, and ideal for high accuracy applications with consistent bondline thickness for superior functionality. This product and its use may be covered by patent 5,716,034 and by one or more pending patent applications.
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技术信息
| 固化方式 | 热+紫外线 |
| 导热性 | 6.0 W/mK |
| 应用 | 芯片焊接 |
| 热膨胀系数 (CTE) | 53.0 ppm/°C |
| 热膨胀系数 (CTE), Above Tg | 156.0 ppm/°C |
| 玻璃化温度 (Tg) | 3.0 °C |
| 粘度 | 185000.0 mPa.s (cP) |
| 触变指数 | 4.8 |
LOCTITE® ABLESTIK QMI529HT-2A1
This electrically conductive adhesive works well for high throughput die attach applications. Expect high accuracy and a controlled bondline.