LOCTITE® ABLESTIK QMI529HT-2A1
Features and Benefits
A 1-part, electrically conductive adhesive that works well for high-throughput die-attach applications. Expect high accuracy and a controlled bond line.
For continuous high resistance to delamination and popcorning, choose LOCTITE® ABLESTIK QMI529HT-2A1. This high-strength, hybrid-technology, electrically conductive die attach adhesive is hydrophobic, and ideal for high-accuracy applications with consistent bond line thickness for superior functionality. This product and its use may be covered by patent 5,716,034 and by one or more pending patent applications.
- Electrically conductive
- Void-free bond line
- Thermally conductive
- Hydrophobic
Documents and Downloads
Looking for a TDS or SDS in another language?
Technical Information
| Applications | Die attach |
| Coefficient of thermal expansion (CTE) | 53.0 ppm/°C |
| Coefficient of thermal expansion (CTE), Above Tg | 156.0 ppm/°C |
| Cure type | Heat cure |
| Glass transition temperature (Tg) | 3.0 °C |
| Thermal conductivity | 6.0 W/mK |
| Thixotropic index | 4.8 |
| Viscosity | 185000.0 mPa·s (cP) |
LOCTITE® ABLESTIK QMI529HT-2A1
A 1-part, electrically conductive adhesive that works well for high-throughput die-attach applications. Expect high accuracy and a controlled bond line.