LOCTITE® ABLESTIK 2902
Caratteristiche e vantaggi
This 2-part, solvent-free electrically conductive adhesive is designed for electronic bonding and sealing applications requiring good mechanical and electrical properties.
When you need an electrically- and thermally-conductive adhesive for bonding, sealing or repair in situations where high cure temperatures or hot soldering are not possible, try LOCTITE® ABLESTIK 2902. This 2-part, solvent-free epoxy adhesive is designed for electronic bonding and sealing applications that require a combination of good mechanical and electrical properties. It works on ceramics, many metals, glass and plastic laminates, and passes NASA outgassing standards.
Leggi tutto
Documenti e download
Cerchi una TDS o un SDS in un'altra lingua?
Informazioni tecniche
| Aspetto fisico | Pasta |
| Consigliato per l'uso con | Ceramica |
| Numero dei componenti | Bicomponente |
| Resistenza al taglio, Alluminio | 700.0 psi |
| Resistività di volume, 24 hr. @ 25°C | 0.001 Ohm cm |
| Schema di polimerizzazione, Consigliato @ 25.0 °C | 24.0 ora |
| Temperatura di esercizio | -60.0 - 110.0 °C |
| Temperatura di stoccaggio | 27.0 °C |
| Tipo di polimerizzazione | Temperatura ambiente Polimerizzazione (Ambiente) |
| Viscosità CP52, Speed 10 rpm | 20000.0 mPa.s (cP) |
LOCTITE® ABLESTIK 2902
This 2-part, solvent-free electrically conductive adhesive is designed for electronic bonding and sealing applications requiring good mechanical and electrical properties.