LOCTITE® ABLESTIK 2902

Merkmale und Vorteile

This 2-part, solvent-free electrically conductive adhesive is designed for electronic bonding and sealing applications requiring good mechanical and electrical properties.
When you need an electrically- and thermally-conductive adhesive for bonding, sealing or repair in situations where high cure temperatures or hot soldering are not possible, try LOCTITE® ABLESTIK 2902. This 2-part, solvent-free epoxy adhesive is designed for electronic bonding and sealing applications that require a combination of good mechanical and electrical properties. It works on ceramics, many metals, glass and plastic laminates, and passes NASA outgassing standards.
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Technische Informationen

Anzahl Komponenten 2K
Aushärtetechnik Aushärtung bei Raumtemperatur (Umgebungstemperatur)
Aushärtezyklus, Empfohlen @ 25.0 °C 24.0 h
Betriebstemperatur -60.0 - 110.0 °C
Empfohlen für die Verwendung mit Keramik
Lagertemperatur 27.0 °C
Physikalische Form Paste
Scherfestigkeit, Aluminium 700.0 psi
Viskosität CP52, Speed 10 rpm 20000.0 mPa.s (cP)
Volumenwiderstand, 24 hr. @ 25°C 0.001 Ohm cm