LOCTITE® ABLESTIK 2902
Características y Ventajas
This 2-part, solvent-free electrically conductive adhesive is designed for electronic bonding and sealing applications requiring good mechanical and electrical properties.
When you need an electrically- and thermally-conductive adhesive for bonding, sealing or repair in situations where high cure temperatures or hot soldering are not possible, try LOCTITE® ABLESTIK 2902. This 2-part, solvent-free epoxy adhesive is designed for electronic bonding and sealing applications that require a combination of good mechanical and electrical properties. It works on ceramics, many metals, glass and plastic laminates, and passes NASA outgassing standards.
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Información técnica
| Forma física | Pasta |
| Número de componentes | Bicomponente |
| Programa de curado, Recomendado @ 25.0 °C | 24.0 h |
| Resistencia al corte, Aluminio | 700.0 psi |
| Resistividad de volumen, 24 hr. @ 25°C | 0.001 Ohm cm |
| Se recomienda su uso con | Cerámica |
| Temperatura de almacenaje | 27.0 °C |
| Temperatura de funcionamiento | -60.0 - 110.0 °C |
| Tipo de curado | Curado a Temperatura Ambiente |
| Viscosidad CP52, Speed 10 rpm | 20000.0 mPa.s (cP) |
LOCTITE® ABLESTIK 2902
This 2-part, solvent-free electrically conductive adhesive is designed for electronic bonding and sealing applications requiring good mechanical and electrical properties.