LOCTITE® ABLESTIK 2902
Características e Benefícios
This 2-part, solvent-free electrically conductive adhesive is designed for electronic bonding and sealing applications requiring good mechanical and electrical properties.
When you need an electrically- and thermally-conductive adhesive for bonding, sealing or repair in situations where high cure temperatures or hot soldering are not possible, try LOCTITE® ABLESTIK 2902. This 2-part, solvent-free epoxy adhesive is designed for electronic bonding and sealing applications that require a combination of good mechanical and electrical properties. It works on ceramics, many metals, glass and plastic laminates, and passes NASA outgassing standards.
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Informação Técnica
| Cronograma de cura, Recomendado @ 25.0 °C | 24.0 hr. |
| Forma física | Pasta |
| Força de cisalhamento, Alumínio | 700.0 psi |
| Número de componentes | Bicomponente |
| Recomendado para uso com | Cerâmica |
| Resistividade volumétrica, 24 hr. @ 25°C | 0.001 Ohm cm |
| Temperatura de armazenamento | 27.0 °C |
| Temperatura de operação | -60.0 - 110.0 °C |
| Tipo de cura | Cura à temperatura ambiente |
| Viscosidade CP52, Speed 10 rpm | 20000.0 mPa.s (cP) |
LOCTITE® ABLESTIK 2902
This 2-part, solvent-free electrically conductive adhesive is designed for electronic bonding and sealing applications requiring good mechanical and electrical properties.