LOCTITE® ABLESTIK 2902

Features and Benefits

This 2-part, solvent-free electrically conductive adhesive is designed for electronic bonding and sealing applications requiring good mechanical and electrical properties.
When you need an electrically- and thermally-conductive adhesive for bonding, sealing or repair in situations where high cure temperatures or hot soldering are not possible, try LOCTITE® ABLESTIK 2902. This 2-part, solvent-free epoxy adhesive is designed for electronic bonding and sealing applications that require a combination of good mechanical and electrical properties. It works on ceramics, many metals, glass and plastic laminates, and passes NASA outgassing standards.
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Technical Information

Cure schedule, Recommended @ 25.0 °C 24.0 hr.
Cure type Room Temperature (Ambient) Cure
Number of components 2 Part
Operating temperature -60.0 - 110.0 °C
Physical form Paste
Recommended for use with Ceramic
Shear strength, Aluminum 700.0 psi
Storage temperature 27.0 °C
Viscosity CP52, Speed 10 rpm 20000.0 mPa·s (cP)
Volume resistivity, 24 hr. @ 25°C 0.001 Ohm cm