LOCTITE® ECCOBOND UF 3812
Merkmale und Vorteile
Reworkable epoxy underfill encapsulant for CSP, WLCSP, and BGA production. Compatible with most lead-free solders.
If you're looking for a halogen-free underfill that shows stable performance under thermal stress, consider LOCTITE® ECCOBOND UF 3812™. This black-liquid, epoxy-based underfill showcases excellent thermal cycle performance and sturdy electrical performance under thermal and humid bias. Our ECCOBOND UF 3812™ solution can be used with most Pb-free solders; is designed for the production of CSPs, WLCSPs, and BGAs; and is formulated to flow at room temperature with no additional preheating required.
Weiterlesen
Dokumente und Downloads
Suchen Sie nach einem TDS oder SDS in einer anderen Sprache?
Technische Informationen
| Anwendungen | Unterfüllung, Verkapselung |
| Aushärtetechnik | Aushärtung durch Wärme |
| Aushärtezyklus, @ 130.0 °C | 10.0 Min. |
| Farbe | Schwarz |
| Glasübergangstemperatur (Tg) | 131.0 °C |
| Lagertemperatur | -20.0 °C |
| Speichermodul, DMA @ 25.0 °C 3-point bending | 3004.0 N/mm² (435580.0 psi ) |
| Topfzeit | 3.0 Tag |
| Verarbeitungszeit | 1.0 Tag |
| Viskosität, Physica @ 25.0 °C Spindle CP50-1, Shear Rate 1,000 s⁻¹ | 350.0 mPa.s (cP) |
| Wärmeausdehnungskoeffizient (CTE), Above Tg | 175.0 ppm/°C |
| Wärmeausdehnungskoeffizient (CTE), Below Tg | 48.0 ppm/°C |
LOCTITE® ECCOBOND UF 3812
Reworkable epoxy underfill encapsulant for CSP, WLCSP, and BGA production. Compatible with most lead-free solders.