LOCTITE® ECCOBOND UF 3812

Features and Benefits

Reworkable epoxy underfill encapsulant for CSP, WLCSP, and BGA production. Compatible with most lead-free solders.
If you're looking for a halogen-free underfill that shows stable performance under thermal stress, consider LOCTITE® ECCOBOND UF 3812™. This black-liquid, epoxy-based underfill showcases excellent thermal cycle performance and sturdy electrical performance under thermal and humid bias. Our ECCOBOND UF 3812™ solution can be used with most Pb-free solders; is designed for the production of CSPs, WLCSPs, and BGAs; and is formulated to flow at room temperature with no additional preheating required.
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Technical Information

Applications Encapsulating, Underfilling
Coefficient of thermal expansion (CTE), Above Tg 175.0 ppm/°C
Coefficient of thermal expansion (CTE), Below Tg 48.0 ppm/°C
Colour Black
Cure schedule, @ 130.0 °C 10.0 min.
Cure type Heat cure
Glass transition temperature (Tg) 131.0 °C
Pot life 3.0 day
Storage modulus, DMA @ 25.0 °C 3-point bending 3004.0 N/mm² (435580.0 psi )
Storage temperature -20.0 °C
Viscosity, Physica @ 25.0 °C Spindle CP50-1, Shear Rate 1,000 s⁻¹ 350.0 mPa·s (cP)
Work life 1.0 day