LOCTITE® ECCOBOND UF 3812
Kenmerken en voordelen
Reworkable epoxy underfill encapsulant for CSP, WLCSP, and BGA production. Compatible with most lead-free solders.
If you're looking for a halogen-free underfill that shows stable performance under thermal stress, consider LOCTITE® ECCOBOND UF 3812™. This black-liquid, epoxy-based underfill showcases excellent thermal cycle performance and sturdy electrical performance under thermal and humid bias. Our ECCOBOND UF 3812 solution can be used with most Pb-free solders; is designed for the production of CSPs, WLCSPs, and BGAs; and is formulated to flow at room temperature with no additional preheating required.
Meer info
Documenten en downloads
Op zoek naar een TDS of MSDS in een andere taal?
Technische informatie
| Coëfficiënt van thermische uitzetting (CTE), Above Tg | 175.0 ppm/°C |
| Coëfficiënt van thermische uitzetting (CTE), Below Tg | 48.0 ppm/°C |
| Glasovergangstemperatuur (Tg) | 131.0 °C |
| Kleur | Zwart |
| Opslagmodulus, DMA @ 25.0 °C 3-point bending | 3004.0 N/mm² (435580.0 psi ) |
| Opslagtemperatuur | -20.0 °C |
| Toepassingen | Inkapselen, Ondervulling |
| Uithardingsschema, @ 130.0 °C | 10.0 min. |
| Uithardingstype | Uitharding door warmte |
| Verwerkingstijd | 3.0 dag , 1.0 dag |
| Viscositeit, Physica @ 25.0 °C Spindle CP50-1, Shear Rate 1,000 s⁻¹ | 350.0 mPa.s (cP) |
LOCTITE® ECCOBOND UF 3812
Reworkable epoxy underfill encapsulant for CSP, WLCSP, and BGA production. Compatible with most lead-free solders.