LOCTITE® ECCOBOND UF 3812
Características y Ventajas
This 1-part, reworkable epoxy underfill encapsulant is designed for Ball Grid Array (BGA), Chip Scale Packaging (CSP) and Wafer Level Chip Scale Packages (WLCSPs) production. It is compatible with most lead-free solders.
LOCTITE® ECCOBOND UF 3812 is a halogen-free underfill that shows stable performance under thermal stress. This black-liquid, epoxy-based underfill showcases excellent thermal cycle performance and sturdy electrical performance under thermal and humid bias. It can be used with most Pb-free solders; is designed for the production of BGA, CSP and WLCSPs; and is formulated to flow at room temperature with no additional preheating required.
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Información técnica
| Aplicaciones | Encapsulado, Rellenar |
| Coeficiente de dilatación térmica (CDT), Above Tg | 175.0 ppm/°C |
| Coeficiente de dilatación térmica (CDT), Below Tg | 48.0 ppm/°C |
| Color | Negro |
| Módulo de almacenaje, DMA @ 25.0 °C 3-point bending | 3004.0 N/mm² (435580.0 psi ) |
| Programa de curado, @ 130.0 °C | 10.0 min |
| Temperatura de almacenaje | -20.0 °C |
| Temperatura de transición vítrea (Tg) | 131.0 °C |
| Tiempo de aplicación | 1.0 día |
| Tipo de curado | Curado Térmico |
| Vida de mezcla | 3.0 día |
| Viscosidad, Physica @ 25.0 °C Spindle CP50-1, Shear Rate 1,000 s⁻¹ | 350.0 mPa.s (cP) |
LOCTITE® ECCOBOND UF 3812
This 1-part, reworkable epoxy underfill encapsulant is designed for Ball Grid Array (BGA), Chip Scale Packaging (CSP) and Wafer Level Chip Scale Packages (WLCSPs) production. It is compatible with most lead-free solders.