LOCTITE® ECCOBOND UF 3812

Características y Ventajas

Reworkable epoxy underfill encapsulant for CSP, WLCSP, and BGA production. Compatible with most lead-free solders.
If you're looking for a halogen-free underfill that shows stable performance under thermal stress, consider LOCTITE® ECCOBOND UF 3812. This black-liquid, epoxy-based underfill showcases excellent thermal cycle performance and sturdy electrical performance under thermal and humid bias. Our ECCOBOND UF 3812 solution can be used with most Pb-free solders; is designed for the production of CSPs, WLCSPs, and BGAs; and is formulated to flow at room temperature with no additional preheating required.
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Información técnica

Aplicaciones Encapsulado, Rellenar
Coeficiente de dilatación térmica (CDT), Above Tg 175.0 ppm/°C
Coeficiente de dilatación térmica (CDT), Below Tg 48.0 ppm/°C
Color Negro
Módulo de almacenaje, DMA @ 25.0 °C 3-point bending 3004.0 N/mm² (435580.0 psi )
Programa de curado, @ 130.0 °C 10.0 min
Temperatura de almacenaje -20.0 °C
Temperatura de transición vítrea (Tg) 131.0 °C
Tiempo de aplicación 1.0 día
Tipo de curado Curado Térmico
Vida de mezcla 3.0 día
Viscosidad, Physica @ 25.0 °C Spindle CP50-1, Shear Rate 1,000 s⁻¹ 350.0 mPa.s (cP)