LOCTITE® ABLESTIK 3119
Vlastnosti a výhody
LOCTITE ABLESTIK 3119, Epoxy, Bonding
LOCTITE® ABLESTIK 3119 cures rapidly at relatively low temperature and provides excellent adhesion on a wide range of substrates. Typical applications include the assembly of electronics components which are heat sensitive. Please refer to the TDS for alternate cure schedules.
Viac info
Dokumenty na prevzatie
Hľadáte TL alebo KBÚ v inom jazyku
Technické informácie
| Spôsob vytvrdzovania | Vytvrdzovanie teplom |
| Teplota priepustnosti skla (Tg) | 110.0 °C |
LOCTITE® ABLESTIK 3119
LOCTITE ABLESTIK 3119, Epoxy, Bonding