LOCTITE® ABLESTIK 3119

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LOCTITE ABLESTIK 3119, Epoxy, Bonding
LOCTITE® ABLESTIK 3119 cures rapidly at relatively low temperature and provides excellent adhesion on a wide range of substrates. Typical applications include the assembly of electronics components which are heat sensitive. Please refer to the TDS for alternate cure schedules.
Aprašymas

Techniniai duomenys

Kietėjimo tipas Kietėjimas veikiant šilumai
Stiklėjimo temperatūra (Tg) 110.0 °C