LOCTITE® ABLESTIK 3119

Značajke i prednosti

LOCTITE ABLESTIK 3119, Epoxy, Bonding
LOCTITE® ABLESTIK 3119 cures rapidly at relatively low temperature and provides excellent adhesion on a wide range of substrates. Typical applications include the assembly of electronics components which are heat sensitive. Please refer to the TDS for alternate cure schedules.
Dodatne informacije

Tehnički podaci

Temperatura prelaska u staklo (Tg) 110.0 °C
Tip stvrdnjavanja Toplinsko stvrdnjavanje