LOCTITE® ECCOBOND E 3230
Features and Benefits
LOCTITE ECCOBOND E 3230, Epoxy, Assembly, Sag resistant
LOCTITE® ECCOBOND E 3230 chemically resistant, fast and low temperature heat curing adhesive is formulated for bonding dissimilar engineering substrates commonly used in ink jet applications and other MEMS devices.
Read More
Documents and Downloads
Looking for a TDS or SDS in another language?
Technical Information
| Casson viscosity, @ 25.0 °C Shear Rate 10 s⁻¹ | 45200.0 mPa·s (cP) |
| Cure schedule, @ 100.0 °C | 20.0 min. |
| Cure type | Heat Cure |
| Glass transition temperature (Tg) | 58.0 °C |
| Storage temperature | -20.0 °C |
| Thixotropic index | 1.6 |
LOCTITE® ECCOBOND E 3230
LOCTITE ECCOBOND E 3230, Epoxy, Assembly, Sag resistant