Events & Webinars

View of red driver's side of a car driving down a highway

Join Henkel's Automotive Web-Seminar

Discover Henkel's automotive web-seminar series designed to keep you up-to-date on the latest technology innovations

Henkel partners with Sustainability in Packaging Asia 2022

Learn more about REThink Packaging – Mono Material Packaging

TID Talks:

Technology, Industrials, Digital

3D Illustration of a vehicle interior, focusing on the center console and heads up display

Web-Seminar on Developing a Bond You Can Trust, Henkel's Solutions Automotive Interiors

Lean how Henkel is Developing a Bond You Can Trust, with our Solutions for Automotive Interiors.

Photo of a roll of CDAF conductive die attach film pre-cut as two-in-one six inch and eight inch circular forms for wafer lamination

Low temperature (UV) dual cure adhesive for heat sensitive electronic applications

The number of semiconductor-based sensors is growing rapidly as the demand for sensing functions tends to evolve. Such sensors typically contain heat-sensitive substrates and components (such as MEMS), which limit the processing temperature of thermally cured adhesives and encapsulants to a maximum of 80^°C.

Printed Electronics ThINK Together Events

Welcome to the Henkel Printed Electronics ThINK Together Event Page –
A showcase for our digital events, offering first-hand insights on

latest material innovations for stretchable, flexible & high-speed printable electronics,
material processing advice to improve your screen printability
recommendations for innovative material solutions to create seamlessly connected sensing applications within the field of healthcare, hygiene and consumer surfaces

Grab a coffee and listen into our latest video podcasts.