LOCTITE® ECCOBOND FP4531

If you’re looking for an underfill to increase the reliability of small-gap flip-chips, consider LOCTITE® ECCOBOND FP4531. This epoxy-based underfill encapsulant is formulated to flow easily into the small gaps on flex applications via capillary action. LOCTITE® ECCOBOND FP4531 has a recommended snap-cure schedule of 7 minutes at 160°C (320°F) and passes NASA outgassing standards.