LOCTITE® ECCOBOND FP4531

功能与优点

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One-part, epoxy-based underfill encapsulant for use on flip-chips on flex applications with gaps down to 1 mm.
If you’re looking for an underfill to increase the reliability of small-gap flip-chips, consider LOCTITE® ECCOBOND FP4531. This epoxy-based underfill encapsulant is formulated to flow easily into the small gaps on flex applications via capillary action. LOCTITE® ECCOBOND FP4531 has a recommended snap-cure schedule of 7 minutes at 160°C (320°F) and passes NASA outgassing standards.
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文件和下载

技术 数据表
LOCTITE® ECCOBOND FP4531
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技术信息

弯曲模量 7600.0 N/mm² (1102000.0 psi )