LOCTITE® ECCOBOND FP4531

Features and Benefits

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This 1-part, epoxy-based underfill encapsulant is perfect for use on flip-chips on flex applications with gaps down to 1 mm (0.04").
LOCTITE® ECCOBOND FP4531 is an epoxy-based underfill encapsulant formulated to flow easily into the small gaps on flex applications via capillary action. It has a recommended snap-cure schedule of 7 minutes at 160°C (320°F) and passes NASA outgassing standards.
  • Compatible with small gap sizes
  • Snap-curable
  • Fast flow
  • Passes NASA outgassing
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Documents and Downloads

Technical Data Sheet
LOCTITE® ECCOBOND FP4531
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Technical Information

Flexural modulus 7600.0 N/mm² (1102000.0 psi )