LOCTITE® ECCOBOND BF 4
Caratteristiche e vantaggi
LOCTITE ECCOBOND BF 4 is a black, non-conductive, epoxy adhesive designed to protect optoelectronic applications by encapsulating and providing a secure structural bond.
LOCTITE® ECCOBOND BF 4 is a low moisture, die attach adhesive that combines light cure AA50T and BF -4 to provide reliable alignment and raised ability to withstand temperature and humidity changes. The material offers good adhesion to plastic and low outgassing.
Leggi tutto
Documenti e download
Cerchi una TDS o un SDS in un'altra lingua?
Informazioni tecniche
| Applicazioni | Die attach |
| Colore | Nero |
| Numero dei componenti | Monocomponente |
| Resistenza al taglio | 24.0 kg-f |
| Schema di polimerizzazione, @ 100.0 °C | 30.0 min. |
| Temperatura di stoccaggio | -40.0 °C |
| Temperatura di transizione vetrosa (Tg) | 94.0 °C |
| Viscosità, Brookfield CP51, @ 25.0 °C Speed 5 rpm | 23500.0 mPa.s (cP) |
LOCTITE® ECCOBOND BF 4
LOCTITE ECCOBOND BF 4 is a black, non-conductive, epoxy adhesive designed to protect optoelectronic applications by encapsulating and providing a secure structural bond.