LOCTITE® ECCOBOND BF 4
Caractéristiques et avantages
LOCTITE ECCOBOND BF 4 is a black, non-conductive, epoxy adhesive designed to protect optoelectronic applications by encapsulating and providing a secure structural bond.
LOCTITE® ECCOBOND BF 4 is a low moisture, die attach adhesive that combines light cure AA50T and BF -4 to provide reliable alignment and raised ability to withstand temperature and humidity changes. The material offers good adhesion to plastic and low outgassing.
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Informations techniques
| Applications | Soudage de puce |
| Couleur | Noir |
| Nombre de composants | Mono composant |
| Programme de durcissement, @ 100.0 °C | 30.0 min |
| Résistance au cisaillement | 24.0 kg-f |
| Température de stockage | -40.0 °C |
| Température de transition vitreuse | 94.0 °C |
| Viscosité, Brookfield CP51, @ 25.0 °C Speed 5 rpm | 23500.0 mPa.s (cP) |
LOCTITE® ECCOBOND BF 4
LOCTITE ECCOBOND BF 4 is a black, non-conductive, epoxy adhesive designed to protect optoelectronic applications by encapsulating and providing a secure structural bond.