LOCTITE® ECCOBOND BF 4

Features and Benefits

LOCTITE ECCOBOND BF 4 is a black, non-conductive, epoxy adhesive designed to protect optoelectronic applications by encapsulating and providing a secure structural bond.
LOCTITE® ECCOBOND BF 4 is a low moisture, die attach adhesive that combines light cure AA50T and BF -4 to provide reliable alignment and raised ability to withstand temperature and humidity changes. The material offers good adhesion to plastic and low outgassing.
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Technical Information

Applications Die attach
Colour Black
Cure schedule, @ 100.0 °C 30.0 min.
Glass transition temperature (Tg) 94.0 °C
Number of components 1 part
Shear strength 24.0 kg-f
Storage temperature -40.0 °C
Viscosity, Brookfield CP51, @ 25.0 °C Speed 5 rpm 23500.0 mPa·s (cP)