LOCTITE® ABLESTIK 8200C

Features and Benefits

LOCTITE ABLESTIK 8200C, Proprietary Hybrid Chemistry, Die Attach, Electrically Conductive Adhesive
LOCTITE® ABLESTIK 8200C electrically conductive die attach adhesive is designed for high reliability package applications with medium thermal and electrical requirements. This material offers improved JEDEC performance on QFN type packages.
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Technical Information

Applications Die attach
Coefficient of thermal expansion (CTE) 60.0 ppm/°C
Coefficient of thermal expansion (CTE), Above Tg 130.0 ppm/°C
Colour Silver
Cure schedule, @ 175.0 °C 30 min. ramp 45.0 min.
Cure type Heat cure
Extractable ionic content, Chloride (CI-) 9.0 ppm
Extractable ionic content, Potassium (K+) 9.0 ppm
Extractable ionic content, Sodium (Na+) 9.0 ppm
Glass transition temperature (Tg) 190.0 °C
RT die shear strength, 3 x 3 mm Si die on SPCLF 19.1 kg-f
Tensile modulus, DMTA @ 250.0 °C 759.0 N/mm² (110000.0 psi )
Thermal conductivity 1.2 W/mK
Thixotropic index 5.0
Viscosity, Brookfield CP51, @ 25.0 °C Speed 5 rpm 11500.0 mPa·s (cP)
Volume resistivity 0.00017 Ohm cm