LOCTITE® ABLESTIK 8200C
Features and Benefits
LOCTITE ABLESTIK 8200C, Proprietary Hybrid Chemistry, Die Attach, Electrically Conductive Adhesive
LOCTITE® ABLESTIK 8200C electrically conductive die attach adhesive is designed for high reliability package applications with medium thermal and electrical requirements. This material offers improved JEDEC performance on QFN type packages.
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Technical Information
| Applications | Die attach |
| Coefficient of thermal expansion (CTE) | 60.0 ppm/°C |
| Coefficient of thermal expansion (CTE), Above Tg | 130.0 ppm/°C |
| Color | Silver |
| Cure schedule, @ 175.0 °C 30 min. ramp | 45.0 min. |
| Cure type | Heat cure |
| Extractable ionic content, Chloride (CI-) | 9.0 ppm |
| Extractable ionic content, Potassium (K+) | 9.0 ppm |
| Extractable ionic content, Sodium (Na+) | 9.0 ppm |
| Glass transition temperature (Tg) | 190.0 °C |
| RT die shear strength, 3 x 3 mm Si die on SPCLF | 19.1 kg-f |
| Tensile modulus, DMTA @ 250.0 °C | 759.0 N/mm² (110000.0 psi ) |
| Thermal conductivity | 1.2 W/mK |
| Thixotropic index | 5.0 |
| Viscosity, Brookfield CP51, @ 25.0 °C Speed 5 rpm | 11500.0 mPa·s (cP) |
| Volume resistivity | 0.00017 Ohm cm |
LOCTITE® ABLESTIK 8200C
LOCTITE ABLESTIK 8200C, Proprietary Hybrid Chemistry, Die Attach, Electrically Conductive Adhesive