LOCTITE® ABLESTIK ABP 2035SCR
Značajke i prednosti
LOCTITE ABLESTIK ABP 2036SF, Proprietary Hybrid Chemistry, Die Attach, Non-conductive Adhesive
LOCTITE® ABLESTIK ABP 2036SF non-conductive die attach adhesive has been formulated for use in high throughput die attach applications. This material is designed to minimize stress and resulting warpage between dissimilar surfaces. LOCTITE ABLESTIK ABP 2036SF adhesive is the silane-free version of LOCTITE ABLESTIK 2035SC adhesive.
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Dokumenti i preuzimanja
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Tehnički podaci
| Koeficijent toplinske ekspanzije (CTE) | 50.0 ppm/°C |
| Koeficijent toplinske ekspanzije (CTE), Above Tg | 135.0 ppm/°C |
| Primjene | Ukalupljeno |
| Temperatura prelaska u staklo (Tg) | 118.0 °C |
| Tiksotropni indeks | 4.0 |
| Tip stvrdnjavanja | Toplinsko stvrdnjavanje |
| Toplinska vodljivost | 0.4 W/mK |
| Viskoznost, Brookfield CP51, @ 25.0 °C Speed 5 rpm | 9830.0 mPa.s (cP) |
LOCTITE® ABLESTIK ABP 2035SCR
LOCTITE ABLESTIK ABP 2036SF, Proprietary Hybrid Chemistry, Die Attach, Non-conductive Adhesive