LOCTITE® ABLESTIK ABP 2035SCR
Caractéristiques et avantages
This 1-part, non-conductive, snap-cure adhesive is designed for high-throughput die-attach applications. It offers low stress and excellent adhesion between dissimilar surfaces.
LOCTITE® ABLESTIK ABP 2035SCR is a 1-part, red, non-conductive, silica-filled die-attach adhesive paste for high-throughput applications. It is widely used in electronic applications, particularly smartcards, chip modules, and semiconductor packages. It is designed to minimize stress between the die and substrate, especially across materials with mismatched thermal expansion. Its thixotropic nature allows for easy flow dispensing and reduces migration after application. The product cures fast when exposed to heat.
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Informations techniques
| Applications | Soudage de puce |
| Coefficient de dilatation thermique (CDT) | 50.0 ppm/°C |
| Coefficient de dilatation thermique (CDT), Above Tg | 135.0 ppm/°C |
| Conductivité thermique | 0.4 W/mK |
| Indice thixotropique | 4.0 |
| Température de transition vitreuse | 118.0 °C |
| Type de polymérisation | Polymérisation par la chaleur |
| Viscosité, Brookfield CP51, @ 25.0 °C Speed 5 rpm | 9830.0 mPa.s (cP) |
LOCTITE® ABLESTIK ABP 2035SCR
This 1-part, non-conductive, snap-cure adhesive is designed for high-throughput die-attach applications. It offers low stress and excellent adhesion between dissimilar surfaces.