LOCTITE® 3609
Χαρακτηριστικά και οφέλη
This 1-part, electrically non-conductive adhesive is specially designed for bonding surface mounted devices to printed circuit boards prior to wave soldering, especially where medium to high dispense speeds are required.
If you’re looking for a surface mount adhesive with medium to high dispense speeds, choose LOCTITE® 3609. This epoxy-based adhesive is designed for bonding surface mounted devices to printed circuit boards prior to wave soldering, and is ideal for applications where medium to high dispense speeds, high dot profile, high wet strength and good electrical insulation characteristics are required. It can also be used in lead-free wave solder with both water-based and alcohol-based fluxes.
Διαβάστε περισσότερα
Έγγραφα και λήψεις
Ψάχνετε για TDS ή SDS σε άλλη γλώσσα;
Τεχνικές πληροφορίες
| Αντοχή διάτμησης, Χάλυβας (αποξειδωμένος με αμμοβολή) | 1450.0 psi |
| Αριθμός Συστατικών | 1 Συστατικών |
| Θερμοκρασία αποθήκευσης | 2.0 - 8.0 °C |
| Ιξώδες, Cone & Plate Haake PK100, M10/PK1, 2° | 0.16 - 20.0 Pa∙s |
| Μέθοδος Σκλήρυνσης | Σκλήρυνση με Θερμότητα |
| Φυσική Μορφή | Γέλη |
| Χρώμα | Κόκκινο |
LOCTITE® 3609
This 1-part, electrically non-conductive adhesive is specially designed for bonding surface mounted devices to printed circuit boards prior to wave soldering, especially where medium to high dispense speeds are required.