LOCTITE® 3609

Elementi i pogodnosti

This 1-part, electrically non-conductive adhesive is specially designed for bonding surface mounted devices to printed circuit boards prior to wave soldering, especially where medium to high dispense speeds are required.
If you’re looking for a surface mount adhesive with medium to high dispense speeds, choose LOCTITE® 3609. This epoxy-based adhesive is designed for bonding surface mounted devices to printed circuit boards prior to wave soldering, and is ideal for applications where medium to high dispense speeds, high dot profile, high wet strength and good electrical insulation characteristics are required. It can also be used in lead-free wave solder with both water-based and alcohol-based fluxes.
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Dokumenti i preuzimanja

Tehnički podaci

Boja Crvena
Broj komponenti 1 deo
Fizički oblik Gel
Sila smicanja, Čelik (peskirani) 1450.0 psi
Temperatura čuvanja 2.0 - 8.0 °C
Tip očvršćavanja Očvršćavanje pomoću zagrevanja
Viskoznost, kugla / ploča Haake PK100, M10/PK1, 2° 0.16 - 20.0 Pa∙s