LOCTITE® 3609
Właściwości i korzyści
This 1-part, electrically non-conductive adhesive is specially designed for bonding surface mounted devices to printed circuit boards prior to wave soldering, especially where medium to high dispense speeds are required.
If you’re looking for a surface mount adhesive with medium to high dispense speeds, choose LOCTITE® 3609. This epoxy-based adhesive is designed for bonding surface mounted devices to printed circuit boards prior to wave soldering, and is ideal for applications where medium to high dispense speeds, high dot profile, high wet strength and good electrical insulation characteristics are required. It can also be used in lead-free wave solder with both water-based and alcohol-based fluxes.
Czytaj dalej
Do pobrania
Szukasz Karty Technicznej lub Karty Charakterystyki w innym języku?
Informacje techniczne
| Ilość składników | Jednoskładnikowy |
| Kolor | Czerwony |
| Konsystencja/wygląd | Żel |
| Lepkość, stożek/płyta Haake PK100, M10/PK1, 2° | 0.16 - 20.0 Pa∙s |
| Metoda utwardzania | Utwardzanie ciepłem |
| Temperatura przechowywania | 2.0 - 8.0 °C |
| Wytrzymałość na ścinanie, Stal (piaskowana) | 1450.0 psi |
LOCTITE® 3609
This 1-part, electrically non-conductive adhesive is specially designed for bonding surface mounted devices to printed circuit boards prior to wave soldering, especially where medium to high dispense speeds are required.