LOCTITE® 3609
Caractéristiques et avantages
This 1-part, electrically non-conductive adhesive is specially designed for bonding surface mounted devices to printed circuit boards prior to wave soldering, especially where medium to high dispense speeds are required.
If you’re looking for a surface mount adhesive with medium to high dispense speeds, choose LOCTITE® 3609. This epoxy-based adhesive is designed for bonding surface mounted devices to printed circuit boards prior to wave soldering, and is ideal for applications where medium to high dispense speeds, high dot profile, high wet strength and good electrical insulation characteristics are required. It can also be used in lead-free wave solder with both water-based and alcohol-based fluxes.
En savoir plus
Documents et téléchargements
Vous cherchez une FDS ou une FT dans une autre langue ?
Informations techniques
| Couleur | Rouge |
| Forme physique | Gel |
| Nombre de composants | Mono composant |
| Résistance au cisaillement, Acier (sablé) | 1450.0 psi |
| Température de stockage | 2.0 - 8.0 °C |
| Type de polymérisation | Polymérisation par la chaleur |
| Viscosité, cône & plan Haake PK100, M10/PK1, 2° | 0.16 - 20.0 Pa∙s |
LOCTITE® 3609
This 1-part, electrically non-conductive adhesive is specially designed for bonding surface mounted devices to printed circuit boards prior to wave soldering, especially where medium to high dispense speeds are required.