LOCTITE® 3609
Características e Benefícios
This 1-part, electrically non-conductive adhesive is specially designed for bonding surface mounted devices to printed circuit boards prior to wave soldering, especially where medium to high dispense speeds are required.
LOCTITE® 3609 is a surface mount adhesive with medium to high dispense speeds. This epoxy-based adhesive is designed for bonding surface mounted devices to printed circuit boards prior to wave soldering, and is ideal for applications where medium to high dispense speeds, high dot profile, high wet strength and good electrical insulation characteristics are required. It can also be used in lead-free wave solder with both water-based and alcohol-based fluxes.
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Informação Técnica
| Cor | Vermelho |
| Forma física | Gel |
| Força de cisalhamento, Aço (jateado) | 1450.0 psi |
| Número de componentes | Monocomponente |
| Temperatura de armazenamento | 2.0 - 8.0 °C |
| Tipo de cura | Cura por Calor |
| Viscosidade, cone & placa Haake PK100, M10/PK1, 2° | 0.16 - 20.0 Pa∙s |
LOCTITE® 3609
This 1-part, electrically non-conductive adhesive is specially designed for bonding surface mounted devices to printed circuit boards prior to wave soldering, especially where medium to high dispense speeds are required.