High-Performance Conductive Film Technology for Large Die Automotive Applications: MSL and Board-Level Exposed Pad Performance This article will focus on reliability testing for conductive Die Attach Film (cDAF) technology, specifically on die applications ranging from 1x1 mm2 to 10x10 mm2. Read More
Simplified New Approaches to High Thermal Die Attach Webinar Industry experts Jan Vardaman of TechSearch International and Davy Nakada of Henkel Corporation discuss the market conditions driving a new approach to high thermal conductive die attach materials and processes. Read More
Henkel's Conductive Die Attach Film and Silver Sintering Technologies Deliver Reliable Robust Manufacturing Technology advancement continues to push the semiconductor industry towards ever thinner and higher functioning devices. Henkel introduces the LOCTITE ABLESTIK CDF family of products as a solution that allows robust processing of thinner, smaller, higher-density packages with reduced footprints. This ground-breaking conductive die attach film technology has been brought to the market in a pre-cut format, which enables robust manufacturing. Henkel now offers a portfolio of products which cater to consumer and automotive applications, combining an efficient process with higher reliability (MSL1 packages). In this webinar, Dr. Gupta will cover the commercial success of products launched over the past years and also introduce participants to the latest developments in Silver Sintering Film technology as a viable Pb Free replacement. He will focus on market drivers, the motivation for developing cDAF products and their advantages in resolving manufacturing and reliability challenges... Read More
High Thermal, Semi-Sintering Die Attach Paste a Breakthrough for Emerging Package Performance Requirements Henkel’s latest innovation overcomes performance and processability challenges of traditional materials. Read More